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Home - Success Cases - Semiconductor & Photovoltaics - MOCVD Wafer Automatic Loading and Unloading
MOCVD Wafer Automatic Loading and Unloading
  • Process Application

    -MOCVD wafer automatic loading and unloading

  • Robot Models

    -GBT-P7A-700  (More)

  • System Composition

    -Two SCARA robots and one articulated robot are integrated with the preceding equipment to facilitate the loading and unloading process for both processed and unprocessed wafers.

  • Economic Benefits Achieved by Clients

    -Cost reduction, increased capacity and efficiency 

    -Ensured labor cost savings and production stability

  • Key Technologies

    -Robots certified for use in a dust-free environment, meeting national cleanliness requirements 

    -Equipped with high-speed I/O for wafer mapping inspection 

    -High stability ensures gentle wafer handling and tray placement without collisions

  • Competitive Edges

    -Wafer positioning accuracy: ±0.05mm、±0.1° 

    -Wafer loading and unloading Cycle Time: 425pcs/h 

    -High Position Repeatability (Position repeatability: 0.02mm), ensuring damage

    -free during wafer loading and unloading -Jitter-free in high-speed wafer handling for efficient loading and unloading 

    -Yield Rate: ≥99.9%

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